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| Technical Data Sheet 0603 Package Chip LED(0.4mm Height) 19-217/BHC-YL2M2TY/3T Features Package in 8mm tape on 7diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. Mono-color type. Pb-free The product itself will remain within RoHS complaint Version. Descriptions The 19-217 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. Besides, lightweight makes them ideal for miniature applications. etc. Applications Backlighting in dashboard and switch. Telecommunication: indicator and backlighting in telephone and fax. Flat backlight for LCD, switch and symbol. General use. Device Selection Guide Part No. 19-217/BHC-YL2M2TY/3T Chip Material InGaN Emitted Color Blue Resin Color Water Clear Everlight Electronics Co., Ltd. Device No: DSE-0001439 http://www.everlight.com Prepared date: 8-May-2009 Rev.2 Page: 1 of 10 Prepared by: Qiang yafang 19-217/BHC-YL2M2TY/3T Package Outline Dimensions Note: The tolerances unless mentioned is 0.1mm, Unit = mm Everlight Electronics Co., Ltd. Device No: DSE-0001439 http://www.everlight.com Prepared date: 8-May-2009 Rev.2 Page: 2 of 10 Prepared by: Qiang yafang 19-217/BHC-YL2M2TY/3T Absolute Maximum Ratings (Ta=25) Parameter Reverse Voltage Forward Current Peak Forward Current (Duty 1/10 @1KHz) Power Dissipation Electrostatic Discharge(HBM) Operating Temperature Storage Temperature Soldering Temperature Symbol VR IF IFP Pd ESD Topr Tstg Tsol Rating 5 25 100 95 150 -40 ~ +85 -40 ~ +90 Unit V mA mA mW V Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. Electro-Optical Characteristics (Ta=25) Parameter Luminous Intensity Viewing Angle Peak Wavelength Dominant Wavelength Spectrum Radiation Bandwidth Forward Voltage Reverse Current Symbol Iv 21/2 p d VF IR Min. 14.5 --------470 ----2.6 ----Typ. ----120 468 ----25 --------Max. 28.5 --------475 ----3.0 50 Unit mcd deg nm IF=5mA nm nm V A VR=5V Condition Notes: 1.Tolerance of Luminous Intensity 11% 2.Tolerance of Dominant Wavelength 1nm 3.Tolerance of Forward Voltage 0.05V Everlight Electronics Co., Ltd. Device No: DSE-0001439 http://www.everlight.com Prepared date: 8-May-2009 Rev.2 Page: 3 of 10 Prepared by: Qiang yafang 19-217/BHC-YL2M2TY/3T Bin Range Of Dom. Wavelength Group Y Bin Y Min 470 Max 475 Unit nm Condition IF=5mA Bin Range Of Luminous Intensity Bin L2 M1 M2 Min 14.5 18.0 22.5 Max 18.0 22.5 28.5 mcd IF=5mA Unit Condition Bin Range Of Forward Voltage Group Bin 28 T 29 30 31 Min 2.60 2.70 2.80 2.90 Max 2.70 2.80 2.90 3.00 V IF=5mA Unit Condition Notes: 1.Tolerance of Luminous Intensity 11% 2.Tolerance of Dominant Wavelength 1nm 3.Tolerance of Forward Voltage 0.05V Everlight Electronics Co., Ltd. Device No: DSE-0001439 http://www.everlight.com Prepared date: 8-May-2009 Rev.2 Page: 4 of 10 Prepared by: Qiang yafang 19-217/BHC-YL2M2TY/3T Typical Electro-Optical Characteristics Curves Ta=25C Relative luminous intensity ( % ) I (mA) Ta=25C Wavelength (nm) Forward Current Forward Voltage VF (V) Ta=25C Relative luminous intensity ( % ) Relative luminous intensity ( %) 0 20 40 60 80 100 Forward Current I (mA) Ta=25C 30 1000 100 10 1 -60 -40 -20 Ambient Temperature Ta(C ) 0 10 20 I (mA) Forward Current 40 1.0 0.9 0.8 0.7 0.5 0.3 0.1 0.2 0.4 0.6 50 60 70 80 90 Ambient Temperature Ta (C ) Everlight Electronics Co., Ltd. Device No: DSE-0001439 http://www.everlight.com Prepared date: 8-May-2009 Rev.2 Page: 5 of 10 Prepared by: Qiang yafang 19-217/BHC-YL2M2TY/3T Label explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank Pb EVERLIGHT RoHS CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX QTY : XXX CAT : XXX HUE : XXX REF : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX MADE IN TAIWAN Reel Dimensions Note: The tolerances unless mentioned is 0.1mm, Unit = mm Everlight Electronics Co., Ltd. Device No: DSE-0001439 http://www.everlight.com Prepared date: 8-May-2009 Rev.2 Page: 6 of 10 Prepared by: Qiang yafang 19-217/BHC-YL2M2TY/3T Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel Note: The tolerances unless mentioned is 0.1mm, Unit = mm Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Device No: DSE-0001439 http://www.everlight.com Prepared date: 8-May-2009 Rev.2 Page: 7 of 10 Prepared by: Qiang yafang 19-217/BHC-YL2M2TY/3T Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level90% LTPD10% No. 1 2 Items Reflow Soldering Temperature Cycle Test Condition Temp. : 2605 Min. 5sec. H : +100 15min 5 min L : -40 15min H : +100 5min 10 sec L : -10 5min Temp. : 100 Temp. : -40 IF = 20 mA 85/ 85% RH Test Sample Hours/Cycles Size 6 Min. 300 Cycles 22 PCS. 22 PCS. Ac/Re 0/1 0/1 3 4 5 6 7 Thermal Shock High Temperature Storage Low Temperature Storage DC Operating Life High Temperature / High Humidity 300 Cycles 1000 Hrs. 1000 Hrs. 1000 Hrs. 1000 Hrs. 22 PCS. 22 PCS. 22 PCS. 22 PCS. 22 PCS. 0/1 0/1 0/1 0/1 0/1 Everlight Electronics Co., Ltd. Device No: DSE-0001439 http://www.everlight.com Prepared date: 8-May-2009 Rev.2 Page: 8 of 10 Prepared by: Qiang yafang 19-217/BHC-YL2M2TY/3T Precautions For Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30 or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 605 for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. Device No: DSE-0001439 http://www.everlight.com Prepared date: 8-May-2009 Rev.2 Page: 9 of 10 Prepared by: Qiang yafang 19-217/BHC-YL2M2TY/3T 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http://www.everlight.com Everlight Electronics Co., Ltd. Device No: DSE-0001439 http://www.everlight.com Prepared date: 8-May-2009 Rev.2 Page: 10 of 10 Prepared by: Qiang yafang |
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